EMS Solution

Pick N Place Siemens – D2-I

The SIPLACE D2 is equipped with

two gantries for speed and flexibility.

Component Size  :01005 – 27 x 27 mm

Two 12-Nozzle Collect & Place Heads

Accuracy up to 50 μm at 3 Sigma

Through put:  31,K per hr

Feeders: 90 – 8 mm feeders
 
 
 
 
 
 
 
 
Fine Pitch Placer Siemens –D1-i

Single-gantry solution the new SIPLACE D1/D1s placement machines is equipped with one placement head (as SIPLACE

D1s)

Component Size : 01005 – 200 x 125 mm

Accuracy up to 30 μm at 3 Sigma

Throughput : 15 K per Hr.

Feeders :57 feeders 28 trays.

 

 
 
 
 
 
 

Vitronics Reflow Oven

• High quality and reliability 9 top and Bottom heaters.
• 3 Cooling Zone.
• Full nitrogen with excellent performance
• Board tracking system
• Auto chain lubrication system
• Fan speed control in two groups Soak/reflow)
• Computer controlled width adjustment
• Precise controlled cooling
• Control accuracy at +/-1°C
• Convection motors and heater

XP-243 -Fine Pitch components Placer

• All the fine Pitch Components BGA, QFN. PLCC placed by this machine.
• This machine can handle Tray, stick, tape components .
• Accuracy and repeatability is good.
• It can Handle 0603 to 50mm x 150mm size components with accuracy.
• Throughput – 6.5K per Hr.
• feeders Capacity :
• 50 nos – 8 mm feeders,
• 20 tray feeders.

 

 

CP-6  High speed chip shooter

Throughput – 40k comp per Hr.
Less time for changeover due to 2 device tables
Table Height adjustment made easy
Board Size:
Min.- 80mm x 50mm (3” x 2”)
Max.- 457mm x 356mm (18”x14”)
Thickness – 0.8 – 4 mm
Feeders,
140 8mm feeders/ different components.
Can be use up to 32mm feeders.
 
 
Orbotech -AOI

SEHO wave soldering machine.

Manual Insertion